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SRPS EN 61192-3:2009

Workmanship requirements for soldered electronic assemblies - Part 3: Through-hole mount assemblies

Nov 30, 2009
95.99   Withdrawal of Standard   May 31, 2019

General information

95.99     May 31, 2019

ISS

N040

European Norm

31.190  

English  

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Scope

Specifies general requirements for workmanship in through-hole mount soldered assemblies on organic substrates, on printed boards, and on similar laminates attached to the surface(s) of inorganic substrates. It applies to assemblies that are totally through-hole or mixed assemblies that include surface-mounting or other related assembly technologies, for example, terminals, wires.

Life cycle

NOW

WITHDRAWN
SRPS EN 61192-3:2009
95.99 Withdrawal of Standard
May 31, 2019

Related project

Adopted from EN 61192-3:2003