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SRPS EN 60068-2-54:2010

Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method

Jul 30, 2010
95.99   Withdrawal of Standard   May 29, 2020

General information

95.99     May 29, 2020

ISS

N040

European Norm

19.040     31.020  

English  

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Scope

Outlines Test Ta, solder bath wetting balance method applicable for any shape of component terminations to determine the solderability. It is especially suitable for reference testing and for components that cannot be quantitatively tested by other methods. For surface mounting devices (SMD), IEC 60068-2-69 should be applied if it is suitable. It provides the standard procedures for solder alloys containing lead (Pb) and for lead-free solder alloys.

Life cycle

PREVIOUSLY

WITHDRAWN
SRPS N.A5.781:1994

NOW

WITHDRAWN
SRPS EN 60068-2-54:2010
95.99 Withdrawal of Standard
May 29, 2020

REVISED BY

PUBLISHED
SRPS EN 60068-2-69:2017

Related project

Adopted from EN 60068-2-54:2006