Withdrawn
Outlines Test Ta, solder bath wetting balance method applicable for any shape of component terminations to determine the solderability. It is especially suitable for reference testing and for components that cannot be quantitatively tested by other methods. For surface mounting devices (SMD), IEC 60068-2-69 should be applied if it is suitable. It provides the standard procedures for solder alloys containing lead (Pb) and for lead-free solder alloys.
WITHDRAWN
SRPS N.A5.781:1994
WITHDRAWN
SRPS EN 60068-2-54:2010
95.99
Withdrawal of Standard
May 29, 2020
PUBLISHED
SRPS EN 60068-2-69:2017