Withdrawn
Provides information on land pattern geometries used for the surface attachment of electronic components. The intent of the information presented herein is to provide the appropriate size, shape and tolerance of surface-mount land patterns to insure sufficient area for the appropriate solder fillet, and also to allow for inspection, testing, and rework of those solder joints.
WITHDRAWN
SRPS EN 61188-5-1:2010
95.99
Withdrawal of Standard
Apr 30, 2024
PUBLISHED
SRPS EN IEC 61188-6-1:2021