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SRPS EN 61188-5-2:2010

Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components

Jul 30, 2010

General information

90.93     Jan 5, 2026

90.00    Jan 5, 2031

ISS

N040

European Norm

31.180     31.190  

English  

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Published

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Scope

Provides information on land pattern geometries used for the surface attachment of discrete electronic components. Provides the appropriate size, shape and tolerances of surface mount land patterns to ensure sufficient area for the appropriate solder fillet, and also allow for inspection, testing and rework of resulting solder joints.

Life cycle

NOW

PUBLISHED
SRPS EN 61188-5-2:2010
90.93 Standard confirmed
Jan 5, 2026

Related project

Adopted from EN 61188-5-2:2003