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SRPS EN 61188-5-8:2010

Printed boards and printed board assemblies - Design and use - Part 5-8: Attachment (land/joint) considerations - Area array components (BGA, FBGA, CGA, LGA)

Jul 30, 2010

General information

60.60    

ISS

N040

European Norm

31.180  

English  

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Published

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Scope

Provides information on land pattern geometries used for the surface attachment of electronic components with area array terminations in the form of solder balls, solder columns or protective coated lands. The intent of the information presented herein is to provide the appropriate size, shape and tolerances of surface mount land patterns to ensure sufficient area for the appropriate solder joint, and also allow for inspection, testing and reworking of those solder joints.

Life cycle

NOW

PUBLISHED
SRPS EN 61188-5-8:2010
60.60 Standard published

Related project

Adopted from EN 61188-5-8:2008