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SRPS EN 61190-1-2:2010

Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly

Jul 30, 2010
95.99   Withdrawal of Standard   May 31, 2017

General information

95.99     May 31, 2017

ISS

N040

European Norm

31.190  

English  

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Scope

IEC 61190-1-2:2007 specifies general requirements for the characterization and testing of solder pastes used to make high-quality electronic interconnections in electronics assembly. This standard serves as a quality control document and is not intended to relate directly to the material's performance in the manufacturing process. The main changes with regard to the first edition concern a definition of lead-free solder alloy and an explanation of solder ball test standards.

Life cycle

NOW

WITHDRAWN
SRPS EN 61190-1-2:2010
95.99 Withdrawal of Standard
May 31, 2017

REVISED BY

PUBLISHED
SRPS EN 61190-1-2:2015

Related project

Adopted from EN 61190-1-2:2007