Phone: (011) 7541-421, 3409-301, 3409-335, 6547-293, 3409-310
E-mail: Standards sales: prodaja@iss.rs Education: iss-edukacija@iss.rs Information about standards: infocentar@iss.rs
Stevana Brakusa 2, 11030 Beograd
Main menu

SRPS EN 60191-6-18:2011

Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)

Apr 21, 2011

General information

60.60     Apr 21, 2011

ISS

N022

European Norm

31.080.01  

English  

From plan 2011

Buying

Published

Language in which you want to receive the document.

Scope

IEC 60191-6-18:2010 provides standard outline drawings, dimensions, and recommended variations for all square ball grid array packages (BGA), whose terminal pitch is 1 mm or larger.

Life cycle

NOW

PUBLISHED
SRPS EN 60191-6-18:2011
60.60 Standard published
Apr 21, 2011

Related project

Adopted from EN 60191-6-18:2010