Phone: (011) 7541-421, 3409-301, 3409-335, 6547-293, 3409-310
E-mail: Standards sales: prodaja@iss.rs Education: iss-edukacija@iss.rs Information about standards: infocentar@iss.rs
Stevana Brakusa 2, 11030 Beograd
Main menu

SRPS EN 60191-6-17:2013

Mechanical standardization of semiconductor devices - Part 6-17: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for stacked packages - Fine-pitch ball grid array and fine-pitch land grid array (P-PFBGA and P-PFLGA)

Jan 28, 2013

General information

60.60     Jan 28, 2013

ISS

N022

European Norm

31.080.01  

English  

plan 2012.

Buying

Published

Language in which you want to receive the document.

Scope

IEC 60191-6-17:2011 provides outline drawings and dimensions for stacked packages and individual stackable packages in the form of FBGA or FLGA.

Life cycle

NOW

PUBLISHED
SRPS EN 60191-6-17:2013
60.60 Standard published
Jan 28, 2013

Related project

Adopted from EN 60191-6-17:2011