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SRPS EN 60191-6-20:2013

Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ)

Jan 28, 2013

General information

60.60     Jan 28, 2013

ISS

N022

European Norm

31.080.01  

English  

plan 2012.

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Scope

IEC 60191-6-20:2010 specifies methods to measure package dimensions of small outline J-lead-packages (SOJ), package outline form E in accordance with IEC 60191-4.

Life cycle

NOW

PUBLISHED
SRPS EN 60191-6-20:2013
60.60 Standard published
Jan 28, 2013

Related project

Adopted from EN 60191-6-20:2010