0 Items
My account
Phone: (011) 7541-421, 3409-301, 3409-335, 6547-293, 3409-310
E-mail: Standards sales: prodaja@iss.rs Education: iss-edukacija@iss.rs Information about standards: infocentar@iss.rs
Stevana Brakusa 2, 11030 Beograd
Main menu

SRPS EN 61191-2:2014

Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies

Sep 22, 2014
95.99   Withdrawal of Standard   Nov 30, 2020

General information

95.99     Nov 30, 2020

ISS

N040

European Norm

31.190     31.240  

English  

Buying

Withdrawn

Language in which you want to receive the document.

Scope

IEC 61191-2:2013 gives the requirements for surface mount solder connections. The requirements pertain to those assemblies that are totally surface mounted or to the surface mounted portions of those assemblies that include other related technologies (e.g. through-hole, chip mounting, terminal mounting, etc.). This edition includes the following significant technical changes with respect to the previous edition: - IPC-A-610 on workmanship has been included as a normative reference; - some of the terminology used in the document has been updated; - references to IEC standards have been corrected; - the use of lead-free solder paste and plating are addressed.

Life cycle

PREVIOUSLY

WITHDRAWN
SRPS EN 61191-2:2009

NOW

WITHDRAWN
SRPS EN 61191-2:2014
95.99 Withdrawal of Standard
Nov 30, 2020

REVISED BY

PUBLISHED
SRPS EN 61191-2:2018

Related project

Adopted from EN 61191-2:2013