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SRPS EN 60749-28:2017

Semiconductor devices - Mechanical and climatic test methods - Part 28: Electrostatic discharge (ESD) sensitivity testing - Charged device model (CDM) - device level

Dec 25, 2017
95.99   Withdrawal of Standard   Jan 30, 2026

General information

95.99     Jan 30, 2026

ISS

N022

European Norm

31.080.01  

English  

sednica 2017-12-06

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Scope

IEC 60749-28:2017(E) establishes the procedure for testing, evaluating, and classifying devices and microcircuits according to their susceptibility (sensitivity) to damage or degradation by exposure to a defined field-induced charged device model (CDM) electrostatic discharge (ESD). All packaged semiconductor devices, thin film circuits, surface acoustic wave (SAW) devices, opto-electronic devices, hybrid integrated circuits (HICs), and multi-chip modules (MCMs) containing any of these devices are to be evaluated according to this document. To perform the tests, the devices are assembled into a package similar to that expected in the final application. This CDM document does not apply to socketed discharge model testers. This document describes the field-induced (FI) method. An alternative, the direct contact (DC) method, is described in Annex I.

The purpose of this document is to establish a test method that will replicate CDM failures and provide reliable, repeatable CDM ESD test results from tester to tester, regardless of device type. Repeatable data will allow accurate classifications and comparisons of CDM ESD sensitivity levels.

Life cycle

NOW

WITHDRAWN
SRPS EN 60749-28:2017
95.99 Withdrawal of Standard
Jan 30, 2026

REVISED BY

PUBLISHED
SRPS EN IEC 60749-28:2022

Related project

Adopted from EN 60749-28:2017