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SRPS EN 60286-3:2014

Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes

Sep 22, 2014
95.99   Withdrawal of Standard   Mar 31, 2022

General information

95.99     Mar 31, 2022

ISS

N040

European Norm

31.020     31.240  

English  

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Scope

IEC 60286-3:2013 is applicable to the tape packaging of electronic components without leads or with lead stumps, intended to be connected to electronic circuits. It includes only those dimensions that are essential for the taping of components intended for the above-mentioned purposes. This standard also includes requirements related to the packaging of singulated die products including bare die and bumped die (flip chips). This fifth edition cancels and replaces the fourth edition, published in 2007, as well as IEC 60286-3-1, published in 2009 and IEC 60286-3-2, published in 2009. It constitutes a full layout revision. In addition, this edition includes the following significant technical changes with respect to the previous edition: a) integration of IEC 60286-3-1:2009 as type 1b (Packaging of surface mount components on continuous pressed carrier tapes); b) integration of IEC 60286-3-2:2009 as type 2b (Packaging of surface mount components on blister carrier tapes 4 mm in width).

Life cycle

PREVIOUSLY

WITHDRAWN
SRPS EN 60286-3:2011

PUBLISHED
SRPS EN 60286-3-2:2011

PUBLISHED
SRPS EN 60286-3-1:2011

NOW

WITHDRAWN
SRPS EN 60286-3:2014
95.99 Withdrawal of Standard
Mar 31, 2022

REVISED BY

PUBLISHED
SRPS EN IEC 60286-3:2019

Related project

Adopted from EN 60286-3:2013

Adopted from EN 60286-3:2013/AC:2013