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SRPS EN 60068-2-83:2014

Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste

Sep 22, 2014

General information

60.60     Sep 22, 2014

ISS

N040

European Norm

19.040     31.190  

English  

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Scope

IEC 60068-2-83:2011 provides methods for comparative investigation of the wettability of the metallic terminations or metallized terminations of SMDs with solder pastes. Data obtained by these methods are not intended to be used as absolute quantitative data for pass - fail purposes. NOTE: Different solderability test methods for SMD are described in IEC 60068-2-58 and IEC 60068-2-69. IEC 60068-2-58 prescribes visual evaluation using solder bath and reflow method, IEC 60068-2-69 prescribes wetting balance evaluation using solder bath and solder globule method.

Life cycle

NOW

PUBLISHED
SRPS EN 60068-2-83:2014
60.60 Standard published
Sep 22, 2014

REVISED BY

PROJECT
dnaSRPS EN IEC 60068-2-83:2023

Related project

Adopted from EN 60068-2-83:2011