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SRPS EN 61189-5-3:2016

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3: General test methods for materials and assemblies - Soldering paste for printed board assemblies

Mar 22, 2016

General information

60.60     Mar 22, 2016

ISS

N040

European Norm

31.180  

English  

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Scope

IEC 61189-5-3:2015 is a catalogue of test methods representing methodologies and procedures that can be applied to test printed board assemblies. This part of IEC 61189 focuses on test methods for soldering paste based on the existing IEC 61189-5 and IEC 61189-6. In addition, it includes test methods of soldering paste for lead free soldering.

Life cycle

NOW

PUBLISHED
SRPS EN 61189-5-3:2016
60.60 Standard published
Mar 22, 2016

Related project

Adopted from EN 61189-5-3:2015