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SRPS EN 61189-3-719:2017

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719: Test methods for interconnection structures (printed boards) - Monitoring of single plated-through hole (PTH) resistance change during temperature cycling

Jul 31, 2017

General information

60.60     Jul 31, 2017

ISS

N040

European Norm

31.180  

English  

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Scope

IEC 61189-3-719:2016 specifies a test method to monitor the resistance of single plated-through holes (PTHs) in printed circuit boards (PCBs) to determine the PTH durability under thermo-mechanical stress induced by temperature cycling.

Life cycle

NOW

PUBLISHED
SRPS EN 61189-3-719:2017
60.60 Standard published
Jul 31, 2017

Related project

Adopted from EN 61189-3-719:2016