SRPS EN 62137:2009/AC:2017

Environmental and endurance testing - Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN

Scope

Specifies the test method and guidelines for evaluating the quality and reliability of boards, solder lands, solder process and solder joints of reflow solder mounted area array type packages and peripheral terminal type packages. Tests for durability against mechanical and thermal stress received during or after the mounting process of discrete semiconductor devices and of integrated circuits used mainly for industrial and consumer use equipment.