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SRPS EN IEC 61188-6-4:2019

Printed boards and printed board assemblies - Design and use - Part 6-4: Land pattern design - Generic requirements for dimensional drawings of surface mounted components (SMD) from the viewpoint of land pattern design

Aug 30, 2019

General information

60.60     Aug 30, 2019

ISS

N040

European Norm

31.180     31.18  

English  

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Scope

IEC 61188-6-4:2019 specifies generic requirements for dimensional drawings of SMD from the viewpoint of land pattern design.

The purpose of this document is to prevent land pattern design issues caused by lack of information and/or misuse of the information from SMD outline drawing as well as to improve the utilization of IEC 61188 series. This document is applicable to the SMD of semiconductor devices and electrical components.

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PUBLISHED
SRPS EN IEC 61188-6-4:2019
60.60 Standard published
Aug 30, 2019

Related project

Adopted from EN IEC 61188-6-4:2019

Adopted from IEC 61188-6-4:2019 ED1 IDENTICAL