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SRPS EN IEC 61760-2:2021

Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide

Dec 31, 2021

General information

60.60     Dec 31, 2021

ISS

N040

European Norm

31.020     31.240     31.24  

English  

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Scope

This International Standard describes the transportation and storage conditions for surface mounting devices (SMDs) that are fulfilled in order to enable trouble-free processing of surface mounting devices, both active and passive. (Conditions for printed boards are not taken into consideration.)
The object of this standard is to ensure that users of SMDs receive and store products tha can be further processed (e.g. positioned, soldered) without prejudice to quality and reliability. Improper transportation and storage of SMDs may cause deterioration and result in assembly problems such as poor solderability, delamination and "popcorning".

Life cycle

PREVIOUSLY

PUBLISHED
SRPS EN 61760-2:2009

NOW

PUBLISHED
SRPS EN IEC 61760-2:2021
60.60 Standard published
Dec 31, 2021

Related project

Adopted from EN IEC 61760-2:2021

Adopted from IEC 61760-2:2021 ED3 IDENTICAL