Projects

Integrated Circuits - Standard roadmap for chiplet ICs

00.00   Proposal for new project received

integrated circuits – Three Dimensional Integrated Circuits Part x: In-line thermal measurement of warpage

00.00   Proposal for new project received

Integrated circuits – Part X: Standardization Roadmap for Fan-Out Packages

00.00   Proposal for new project received

IEC60191-6-23 Ed.1.0 :Standardization roadmap for fan-out packages

00.99   Approval to ballot proposal for new project

Thermal standardization on semiconductor packages - Part 2-3: 3D thermal simulation models of semiconductor packages for steady-state analysis - LQFP packages

10.60   Close of voting

IEC 6xxxxx-2: Required Specifications of package substrates for advanced semiconductor packaging - Part 2 Failure Analysis Methods for Current Induced Quality Test of Package Substrates

00.00   Proposal for new project received

IEC 6xxxxx-3: Required Specifications of package substrates for advanced semiconductor packaging - Part 3 Standard Substrates structure for Current Induced Quality Test of Package Substrates

00.00   Proposal for new project received

Future IEC 63378-6-2 ED1: Thermal standardization on semiconductor packages - Part 6-2: Thermal resistance and capacitance model for transient temperature prediction at junction and measurement points - Model creation method using a measurement data of semiconductor device

10.60   Close of voting

Test method of sound variation detection sensors for fire detection

00.99   Approval to ballot proposal for new project

Semiconductor devices - Part 20: Machine-Interpretable Data Sheet for Power Semiconductors: Requirements for Data Format and Data Access for Power Electronic Design Tools

10.60   Close of voting

Semiconductor devices - Part 14-XX: Semiconductor sensors - Performance test method for capacitive fingerprint sensors

10.60   Close of voting

Semiconductor devices - Part 14-15: Semiconductor sensors - Performance test method of dynamic vision sensors

10.60   Close of voting

Semiconductor sensors - Measurement method for microchannel integrated resonant mass sensors in surface adsorption mode

10.20   New project ballot initiated

CONNECTORS FOR ELECTRONIC EQUIPMENT PRODUCT REQUIREMENTS Part 8-10X: Power connectors – Detail specification for 2-pole snap locking power rectangular connectors with plastic housing for rated current of 63 A

00.99   Approval to ballot proposal for new project

Inductors - Near Magnetic and Electric Field Characterization

00.00   Proposal for new project received

Ferrite cores - Guidelines on dimensions and the limits of surface irregularities - Part 17: Balun-cores

10.60   Close of voting

<em>Standardized Data Format for Mission Profiles</em>

00.00   Proposal for new project received

Role-based Access Control – Definition of roles and permissions for engineering

00.99   Approval to ballot proposal for new project