Projects

Composite insulated cross-arms with AC rated voltage greater than 1 000 V and DC voltage greater than 1 500 V – Definitions, design criteria, test methods and acceptance criteria

20.99   WD approved for registration as CD

Industrial networks – 5G Communication Technology – Part 1: Terms, definitions and fundamentals

40.20   DIS ballot initiated: 12 weeks

Replay Tools for radioactive material detection systems

30.60   Close of voting/ comment period

Application of IEC 63339 to Smart Manufacturing Reference Models

50.00   Final text received or FDIS registered for formal approval

Application of IEC 63339 to smart manufacturing reference models

30.99   CD approved for registration as DIS

Plugs, socket-outlets, ship couplers for low-voltage shore connection systems (LVSC-systems) in Direct Current (DC)

20.99   WD approved for registration as CD

Guidelines for joint control for hydroelectric power plants

20.99   WD approved for registration as CD

Evaluation of hydrophobicity retention of polymeric insulating materials under high voltage stress with the dynamic drop test

30.60   Close of voting/ comment period

Arc Hazards and Safety in LVDC - Part 1: Series arc characteristics between brass electrodes

20.99   WD approved for registration as CD

Performance of power electronics transformer for flexible transmission and distribution systems

30.60   Close of voting/ comment period

Grid compliance test for photovoltaic power plants

20.99   WD approved for registration as CD

Hazard analysis due to using C-UAS system in nuclear site

50.00   Final text received or FDIS registered for formal approval

Quantum technologies – Terminology and quantities – General quantities

20.99   WD approved for registration as CD

Semiconductor devices - Reliability test methods for vibration energy harvesters - Part 1: Mechanical reliability under shock

40.00   DIS registered

Reliability evaluation methods for vibration energy harvesters - Part 2: Temperature and humidity

20.99   WD approved for registration as CD

Thermal design of electronics assemblies with miniaturised surface mounting devices and related measurements -<br /> Part 1: Guideline for thermal design of applications where the heat dissipation path to the board is dominant

30.60   Close of voting/ comment period

Thermal design of electronics assemblies with miniaturised surface mounting devices and related measurements -<br /> Part 2: Method for evaluating thermal conductivity of circuit boards with polymer composites by using finite element analysis and measurements

30.60   Close of voting/ comment period

Thermal design of electronics assemblies with miniaturised surface mounting devices and related measurements - Part 3: Determination for temperature measurement in miniaturised surface mounting devices using thermocouples

30.60   Close of voting/ comment period