Projects

Technical Specification for Automatic Voltage Control of Power System with Integration of lBR (Inverter based Resource)

10.20   New project ballot initiated

Technical Specification for System Restoration of Interconnected Power Systems Using VSC-HVDC

10.20   New project ballot initiated

Guidelines for assessment of power system resilience

10.20   New project ballot initiated

Railway Applications – Urban Guided Transport Management And Command/Control Systems – Part 4: Interface specifications

10.20   New project ballot initiated

Standardization of Heat-Loss Measurement of ancillary systems to maintain the superconducting state, such as thermal insulation pipe and/or cryostat for superconducting cables and current leads

00.00   Proposal for new project received

Materials for printed boards and other interconnecting structures - Part 2-XX: Reinforced base materials clad and unclad – Non-halogenated epoxide modified bismaleimide/triazine with filler woven glass laminate sheets of low thermal expansion and flammability (vertical burning test), copper-clad for IC substrate

10.60   Close of voting

Materials for circuit boards and other interconnecting structures - Part 3-X: Sectional specification set for unreinforced base materials, clad and unclad - Build-up film of defined dissipation factor (greater than 0,0030 and equal to or less than 0,0050 at 10 GHz) for rigid organic package substrate, unclad

10.60   Close of voting

Test method for electrical materials, circuit board and other interconnection structures and assemblies - Part 2-X: Test methods for interconnection structures - Test methods for relative permeability and magnetic loss tangent of magnetic dielectric materials for circuit boards at 1 MHz to 1 GHz using impedance analyzer

10.60   Close of voting

Thermography test method for printed circuit interconnection defects

10.60   Close of voting

Materials for circuit boards and other interconnecting structures - Part 3-X: Sectional specification set for unreinforced base materials, clad and unclad – Build-up film of defined dissipation factor (greater than 0,0050 and equal to or less than 0,0080 at 10 GHz) for rigid organic package substrate, unclad

10.60   Close of voting

Materials for circuit boards and other interconnecting structures - Part 3-X: Sectional specification set for unreinforced base materials, clad and unclad – Build-up film of defined dissipation factor (greater than 0,0080 and equal to or less than 0,0200 at 10 GHz) for rigid organic package substrate, unclad

10.60   Close of voting

Circuit Board 2D Barcode Marking Requirements

10.60   Close of voting

Thermal Endurance Test Method for Flexible Optic-Electric Circuit

00.99   Approval to ballot proposal for new project

PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES– DESIGN AND USE - Part 8: 3D shape data for CAD component library

00.99   Approval to ballot proposal for new project

Noncontact Temperature measurement for LAB using IR camera

00.00   Proposal for new project received

Electrical relay as interface for use in power applications (industrial and residential use)

10.20   New project ballot initiated

Requirements and roadmap for DC protection function standardisation

00.00   Proposal for new project received

Insulation co-ordination for HVDC system — Part 1: Definitions, principles and rules

00.99   Approval to ballot proposal for new project