Projekti

Guidelines for assessment of power system resilience

10.20   Početak izjašnjavanja o predlogu

Railway Applications – Urban Guided Transport Management And Command/Control Systems – Part 4: Interface specifications

10.20   Početak izjašnjavanja o predlogu

Standardization of Heat-Loss Measurement of ancillary systems to maintain the superconducting state, such as thermal insulation pipe and/or cryostat for superconducting cables and current leads

00.00   Podnet predlog novog projekta

Materials for printed boards and other interconnecting structures - Part 2-XX: Reinforced base materials clad and unclad – Non-halogenated epoxide modified bismaleimide/triazine with filler woven glass laminate sheets of low thermal expansion and flammability (vertical burning test), copper-clad for IC substrate

10.60   Završetak izjašnjavanja o predlogu

Materials for circuit boards and other interconnecting structures - Part 3-X: Sectional specification set for unreinforced base materials, clad and unclad - Build-up film of defined dissipation factor (greater than 0,0030 and equal to or less than 0,0050 at 10 GHz) for rigid organic package substrate, unclad

10.60   Završetak izjašnjavanja o predlogu

Test method for electrical materials, circuit board and other interconnection structures and assemblies - Part 2-X: Test methods for interconnection structures - Test methods for relative permeability and magnetic loss tangent of magnetic dielectric materials for circuit boards at 1 MHz to 1 GHz using impedance analyzer

10.60   Završetak izjašnjavanja o predlogu

Thermography test method for printed circuit interconnection defects

10.60   Završetak izjašnjavanja o predlogu

Materials for circuit boards and other interconnecting structures - Part 3-X: Sectional specification set for unreinforced base materials, clad and unclad – Build-up film of defined dissipation factor (greater than 0,0050 and equal to or less than 0,0080 at 10 GHz) for rigid organic package substrate, unclad

10.60   Završetak izjašnjavanja o predlogu

Materials for circuit boards and other interconnecting structures - Part 3-X: Sectional specification set for unreinforced base materials, clad and unclad – Build-up film of defined dissipation factor (greater than 0,0080 and equal to or less than 0,0200 at 10 GHz) for rigid organic package substrate, unclad

10.60   Završetak izjašnjavanja o predlogu

Circuit Board 2D Barcode Marking Requirements

10.60   Završetak izjašnjavanja o predlogu

Thermal Endurance Test Method for Flexible Optic-Electric Circuit

00.99   Predlog novog projekta se prihvata

PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES– DESIGN AND USE - Part 8: 3D shape data for CAD component library

00.99   Predlog novog projekta se prihvata

Noncontact Temperature measurement for LAB using IR camera

00.00   Podnet predlog novog projekta

Electrical relay as interface for use in power applications (industrial and residential use)

10.20   Početak izjašnjavanja o predlogu

Requirements and roadmap for DC protection function standardisation

00.00   Podnet predlog novog projekta

Insulation co-ordination for HVDC system — Part 1: Definitions, principles and rules

00.99   Predlog novog projekta se prihvata

Insulation co-ordination for HVDC system — Part 2: Application guidelines for line commutated converter (LCC) stations

00.99   Predlog novog projekta se prihvata

Drafting of publications on electromagnetic field exposure assessment methods

30.99   Nacrt komisije standarda odobrava se za javnu raspravu