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IEC 61189-3-303 ED1

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 3-303: Test methods for interconnection structures (circuit boards) - Etch factor measurement for traces on circuit boards

General information

30.20     Aug 1, 2025

PCC    Sep 26, 2025

IEC

TC 91

International Standard

31.180  

Life cycle

NOW

PROJECT
IEC 61189-3-303 ED1
30.20 CD study/ballot initiated
Aug 1, 2025

National adoptions

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 3-303: Test methods for interconnection structures (circuit boards) - Etch factor measurement for traces on circuit boards

10.99   New project approved

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