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IEC 63378-2-2 ED1

Thermal standardization on semiconductor packages - Part 2-2: 3D thermal simulation models of semiconductor packages for steady-state analysis - PBGA and FBGA packages

General information

40.20     Feb 13, 2026

PRVC    May 8, 2026

IEC

TC 47/SC 47D

International Standard

31.080.01  

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Life cycle

NOW

PROJECT
IEC 63378-2-2 ED1
40.20 DIS ballot initiated: 12 weeks
Feb 13, 2026

National adoptions

naSRPS EN IEC 63378-2-2:2026  
ISS

Thermal standardization on semiconductor packages - Part 2-2: 3D thermal simulation models of semiconductor packages for steady-state analysis - PBGA and FBGA packages

40.20   DIS ballot initiated: 12 weeks

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