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naSRPS EN IEC 63378-2-2:2026

Thermal standardization on semiconductor packages - Part 2-2: 3D thermal simulation models of semiconductor packages for steady-state analysis - PBGA and FBGA packages

General information

40.20     Feb 13, 2026

ISS

N022

European Norm

31.080.01  

English  

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Life cycle

NOW

PROJECT
naSRPS EN IEC 63378-2-2:2026
40.20 DIS ballot initiated: 12 weeks
Feb 13, 2026

Related project

Adopted from prEN IEC 63378-2-2:2026 IDENTICAL

Adopted from IEC 63378-2-2 ED1 IDENTICAL

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