naSRPS EN IEC 63378-2-2:2026
Thermal standardization on semiconductor packages - Part 2-2: 3D thermal simulation models of semiconductor packages for steady-state analysis - PBGA and FBGA packages
General information
Current stage:
40.20
Effective date:
Feb 13, 2026
Originator:
ISS
Owner:
N022
Type:
European Norm
ICS:
31.080.01
Languages:
English
Buying
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Life cycle
NOW
PROJECT
naSRPS EN IEC 63378-2-2:2026
40.20
DIS ballot initiated: 12 weeks
Feb 13, 2026
Related project
Adopted from
prEN IEC 63378-2-2:2026
IDENTICAL
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