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IEC 61249-3-7 ED1

Materials for circuit boards and other interconnecting structures - Part 3-7: Sectional specification set for unreinforced base materials, clad and unclad - Build-up film of defined dissipation factor (greater than 0,0030 and equal to or less than 0,0050 at 10 GHz) for rigid organic package substrate, unclad

General information

20.99     Aug 21, 2026

CD    Aug 21, 2026

IEC

TC 91

International Standard

31.180  

Life cycle

NOW

PROJECT
IEC 61249-3-7 ED1
20.99 WD approved for registration as CD
Aug 21, 2026