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PNW 91-2066 ED1

Materials for circuit boards and other interconnecting structures - Part 3-X: Sectional specification set for unreinforced base materials, clad and unclad - Build-up film of defined dissipation factor (greater than 0,0030 and equal to or less than 0,0050 at 10 GHz) for rigid organic package substrate, unclad

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10.60     14. 11. 2025.

IEC

TC 91

Međunarodni standard

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PNW 91-2066 ED1
10.60 Završetak izjašnjavanja o predlogu
14. 11. 2025.