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IEC 61249-3-7 ED1

Materials for circuit boards and other interconnecting structures - Part 3-7: Sectional specification set for unreinforced base materials, clad and unclad - Build-up film of defined dissipation factor (greater than 0,0030 and equal to or less than 0,0050 at 10 GHz) for rigid organic package substrate, unclad

Опште информације

20.99     21. 8. 2026.

CD    21. 8. 2026.

IEC

TC 91

Međunarodni standard

31.180  

Apstrakt

Životni ciklus

TRENUTNO

PROJEKAT
IEC 61249-3-7 ED1
20.99 Prednacrt standarda prihvata se kao nacrt standarda
21. 8. 2026.