IEC 61249-3-7 ED1

Materials for circuit boards and other interconnecting structures - Part 3-7: Sectional specification set for unreinforced base materials, clad and unclad - Build-up film of defined dissipation factor (greater than 0,0030 and equal to or less than 0,0050 at 10 GHz) for rigid organic package substrate, unclad

Опште информације

Trenutna faza: 30.20 Effective date: 4. 9. 2026.

Sledeća faza: PCC Datum sledeće faze: 30. 10. 2026.

Inicijator: IEC

Pripada: TC 91

Vrsta: Međunarodni standard

ICS: 31.180

Apstrakt

Životni ciklus

TRENUTNO

PROJEKAT
IEC 61249-3-7 ED1
30.20 Početak izjašnjavanja o nacrtu komisije standarda
4. 9. 2026.

Nacionalna preuzimanja

prSRPS EN IEC 61249-3-7:2026

ISS

Materials for circuit boards and other interconnecting structures - Part 3-7: Sectional specification set for unreinforced base materials, clad and unclad - Build-up film of defined dissipation factor (greater than 0,0030 and equal to or less than 0,0050 at 10 GHz) for rigid organic package substrate, unclad

10.99 Novi projekat se prihvata

N040 Saznaj više

Pregled

Da biste videli ceo sadržaj, morate se registrovati ili prijaviti pomoću korisničkog imena koje već imate.

Prijavite se