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IEC 61249-3-8 ED1

Materials for circuit boards and other interconnecting structures - Part 3-8: Sectional specification set for unreinforced base materials, clad and unclad – Build-up film of defined dissipation factor (greater than 0,0050 and equal to or less than 0,0080 at 10 GHz) for rigid organic package substrate, unclad

General information

30.20     Sep 4, 2026

PCC    Oct 30, 2026

IEC

TC 91

International Standard

31.180  

Life cycle

NOW

PROJECT
IEC 61249-3-8 ED1
30.20 CD study/ballot initiated
Sep 4, 2026

National adoptions

prSRPS EN IEC 61249-3-8:2026  
ISS

Materials for circuit boards and other interconnecting structures - Part 3-8: Sectional specification set for unreinforced base materials, clad and unclad - Build-up film of defined dissipation factor (greater than 0,0050 and equal to or less than 0,0080 at 10 GHz) for rigid organic package substrate, unclad

10.99   New project approved

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