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prSRPS EN IEC 61249-3-8:2026

Materials for circuit boards and other interconnecting structures - Part 3-8: Sectional specification set for unreinforced base materials, clad and unclad - Build-up film of defined dissipation factor (greater than 0,0050 and equal to or less than 0,0080 at 10 GHz) for rigid organic package substrate, unclad

General information

10.99    

ISS

N040

European Norm

31.180  

English  

Life cycle

NOW

PROJECT
prSRPS EN IEC 61249-3-8:2026
10.99 New project approved

Related project

Adopted from prEN IEC 61249-3-8 IDENTICAL

Adopted from IEC 61249-3-8 ED1 IDENTICAL