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PNW 91-2074 ED1

Materials for circuit boards and other interconnecting structures - Part 3-X: Sectional specification set for unreinforced base materials, clad and unclad – Build-up film of defined dissipation factor (greater than 0,0050 and equal to or less than 0,0080 at 10 GHz) for rigid organic package substrate, unclad

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10.60     9. 1. 2026.

IEC

TC 91

Međunarodni standard

Apstrakt

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PNW 91-2074 ED1
10.60 Završetak izjašnjavanja o predlogu
9. 1. 2026.