Phone: (011) 7541-421, 3409-301, 3409-335, 6547-293, 3409-310
E-mail: Standards sales: prodaja@iss.rs Education: iss-edukacija@iss.rs Information about standards: infocentar@iss.rs
Stevana Brakusa 2, 11030 Beograd
Main menu

naSRPS EN IEC 63378-6:2023

Thermal standardization on semiconductor packages - Part 6: Thermal resistance and capacitance model for transient temperature prediction at junction and measurement points

General information

40.60     Jul 25, 2025

ISS

N022

European Norm

31.080.01  

English  

Scope

IEC 63378-6:2026 specifies a thermal resistance and capacitance model for semiconductor packages. This model is named the digital transformation using thermal resistance and capacitance (DXRC) model. It predicts transient temperature at junction and measurement points.

This document applies to semiconductor packages such as TO-252, TO-263, and HSOP. It supports single chip packages dissipated heat from single package surface.

Life cycle

NOW

PROJECT
naSRPS EN IEC 63378-6:2023
40.60 Close of voting
Jul 25, 2025

Related project

Adopted from EN IEC 63378-6:2026 IDENTICAL

Adopted from IEC 63378-6:2026 ED1 IDENTICAL