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SRPS EN IEC 63378-6:2026

Thermal standardization on semiconductor packages - Part 6: Thermal resistance and capacitance model for transient temperature prediction at junction and measurement points

May 29, 2026

General information

60.60     May 29, 2026

ISS

N022

European Norm

31.080.01  

English  

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Scope

IEC 63378-6:2026 specifies a thermal resistance and capacitance model for semiconductor packages. This model is named the digital transformation using thermal resistance and capacitance (DXRC) model. It predicts transient temperature at junction and measurement points.

This document applies to semiconductor packages such as TO-252, TO-263, and HSOP. It supports single chip packages dissipated heat from single package surface.

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PUBLISHED
SRPS EN IEC 63378-6:2026
60.60 Standard published
May 29, 2026

Related project

Adopted from EN IEC 63378-6:2026 IDENTICAL

Adopted from IEC 63378-6:2026 ED1 IDENTICAL