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naSRPS EN IEC 63378-6:2023

Thermal standardization on semiconductor packages - Part 6: Thermal resistance and capacitance model for transient temperature prediction at junction and measurement points

General information

40.60     Jul 25, 2025

ISS

N022

European Norm

31.080.01  

English  

Life cycle

NOW

PROJECT
naSRPS EN IEC 63378-6:2023
40.60 Close of voting
Jul 25, 2025

Related project

Adopted from prEN IEC 63378-6:2025 IDENTICAL

Adopted from IEC 63378-6 ED1 IDENTICAL