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IEC 63378-6 ED1

Thermal standardization on semiconductor packages - Part 6: Thermal resistance and capacitance model for transient temperature prediction at junction and measurement points

General information

60.00     Jan 9, 2026

PPUB    Feb 20, 2026

IEC

TC 47/SC 47D

International Standard

31.080.01  

Life cycle

NOW

PROJECT
IEC 63378-6 ED1
60.00 Standard under publication
Jan 9, 2026

National adoptions

Thermal standardization on semiconductor packages - Part 6: Thermal resistance and capacitance model for transient temperature prediction at junction and measurement points

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