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IEC 63378-6:2026 ED1

Thermal standardization on semiconductor packages - Part 6: Thermal resistance and capacitance model for transient temperature prediction at junction and measurement points

Feb 4, 2026

General information

60.60     Feb 4, 2026

IEC

TC 47/SC 47D

International Standard

31.080.01  

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Scope

IEC 63378-6:2026 specifies a thermal resistance and capacitance model for semiconductor packages. This model is named the digital transformation using thermal resistance and capacitance (DXRC) model. It predicts transient temperature at junction and measurement points.
This document applies to semiconductor packages such as TO-252, TO-263, and HSOP. It supports single chip packages dissipated heat from single package surface.

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PUBLISHED
IEC 63378-6:2026 ED1
60.60 Standard published
Feb 4, 2026

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naSRPS EN IEC 63378-6:2023  
ISS

Thermal standardization on semiconductor packages - Part 6: Thermal resistance and capacitance model for transient temperature prediction at junction and measurement points

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