naSRPS EN IEC 63378-6:2023

Termička standardizacija na kućištima poluprovodnika — Deo 6: Modul termičke otpornosti i kapacitanse za predviđanje temperaturnih tranzijenata na spoju i mernim tačkama

Thermal standardization on semiconductor packages - Part 6: Thermal resistance and capacitance model for transient temperature prediction at junction and measurement points

Apstrakt

IEC 63378-6:2026 specifies a thermal resistance and capacitance model for semiconductor packages. This model is named the digital transformation using thermal resistance and capacitance (DXRC) model. It predicts transient temperature at junction and measurement points.

This document applies to semiconductor packages such as TO-252, TO-263, and HSOP. It supports single chip packages dissipated heat from single package surface.