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dnaSRPS EN IEC 61189-3-720:2025

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-720: Test methods for interconnection structures (circuit boards) - Transmission loss test method for high frequency multilayer circuit boards

General information

50.20     Jul 3, 2026

50.60    Aug 14, 2026

ISS

N040

European Norm

31.180  

English  

Scope

IEC 61189-3-720 ED1 specifies the S parameter test method for the internal transmission circuit of a multilayer circuit board (CB) for high frequency up to 50 GHz. The transmission loss test method that applies the via in pad plated over (VIPPO) structure to the CB surface contributes to improving the signal loss measurement precision and signal integrity of the internal transmission circuit of the high frequency CB. In addition, the use of back-drilling with VIPPO structure can eliminate influence of stubs on signal transmission.

Life cycle

NOW

PROJECT
dnaSRPS EN IEC 61189-3-720:2025
50.20 Proof sent to secretariat or FDIS ballot initiated: 8 weeks
Jul 3, 2026

Related project

Adopted from FprEN IEC 61189-3-720:2026 IDENTICAL

Adopted from IEC 61189-3-720 ED1 IDENTICAL

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