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IEC 61189-3-720 ED1

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-720: Test methods for interconnection structures (circuit boards) - Transmission loss test method for high frequency multilayer circuit boards

General information

50.00     May 22, 2026

CFDIS    Aug 14, 2026

IEC

TC 91

International Standard

31.180  

Life cycle

NOW

PROJECT
IEC 61189-3-720 ED1
50.00 Final text received or FDIS registered for formal approval
May 22, 2026

National adoptions

naSRPS EN IEC 61189-3-720:2025  
ISS

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-720: Test methods for interconnection structures (circuit boards) - Transmission loss test method for high frequency multilayer circuit boards

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