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IEC 61189-3-720 ED1

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-720: Test methods for interconnection structures (circuit boards) - Transmission loss test method for high frequency multilayer circuit boards

General information

50.20     Jul 3, 2026

PRVD    Aug 14, 2026

IEC

TC 91

International Standard

31.180  

Scope

IEC 61189-3-720 ED1 specifies the S parameter test method for the internal transmission circuit of a multilayer circuit board (CB) for high frequency up to 50 GHz. The transmission loss test method that applies the via in pad plated over (VIPPO) structure to the CB surface contributes to improving the signal loss measurement precision and signal integrity of the internal transmission circuit of the high frequency CB. In addition, the use of back-drilling with VIPPO structure can eliminate influence of stubs on signal transmission.

Life cycle

NOW

PROJECT
IEC 61189-3-720 ED1
50.20 Proof sent to secretariat or FDIS ballot initiated: 8 weeks
Jul 3, 2026

National adoptions

dnaSRPS EN IEC 61189-3-720:2025  
ISS

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-720: Test methods for interconnection structures (circuit boards) - Transmission loss test method for high frequency multilayer circuit boards

50.20   Proof sent to secretariat or FDIS ballot initiated: 8 weeks

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