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SRPS EN 61191-3:2009

Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies

Nov 30, 2009
95.99   Withdrawal of Standard   Jul 31, 2020

General information

95.99     Jul 31, 2020

ISS

N040

European Norm

31.240  

English  

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Scope

Prescribes requirements for lead and hole solder assembly. The requirements pertain to those assemblies that are totally lead and hole, through-hole mounting technology (THT), or the THT portions of those assemblies that include other related technologies (i.e. surface mount, chip mounting, terminal mounting).

Life cycle

NOW

WITHDRAWN
SRPS EN 61191-3:2009
95.99 Withdrawal of Standard
Jul 31, 2020

REVISED BY

PUBLISHED
SRPS EN 61191-3:2017

Related project

Adopted from EN 61191-3:1998