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SRPS EN 61191-3:2017

Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies

Dec 25, 2017

General information

60.60     Dec 25, 2017

ISS

N040

European Norm

31.240  

English  

Van plana

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Scope

IEC 61191-3:2017(E) prescribes requirements for lead and hole solder assemblies. The requirements pertain to those assemblies that totally use through-hole mounting technology (THT), or the THT portions of those assemblies that include other related technologies (i.e.. surface mount, chip mounting, terminal mounting).

This edition includes the following significant technical changes with respect to the previous edition:

a) The requirements have been updated to be compliant wit the acceptance criteria in IPC-A-610F.

Life cycle

PREVIOUSLY

WITHDRAWN
SRPS EN 61191-3:2009

NOW

PUBLISHED
SRPS EN 61191-3:2017
60.60 Standard published
Dec 25, 2017

Related project

Adopted from EN 61191-3:2017