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SRPS EN 60068-2-58:2010

Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

Jul 30, 2010
95.99   Withdrawal of Standard   May 31, 2018

General information

95.99     May 31, 2018

ISS

N040

European Norm

19.040     31.190  

English  

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Scope

Outlines test Td, applicable to surface mounting devices, which are intended to mount on substrates. This standard provides the standard procedures for solder alloys containing lead and for lead-free solder alloys. Provides standard procedures for determining the solderability and resistance of soldering heat to lead-free solder alloys and for determining the solderability, dissolution of metallization (see B.3.3) and resistance of soldering heat to solder alloys which are eutectic or near eutectic tin lead solders. Include the solder bath method and reflow method.

Life cycle

PREVIOUSLY

WITHDRAWN
SRPS N.A5.782:1994

NOW

WITHDRAWN
SRPS EN 60068-2-58:2010
95.99 Withdrawal of Standard
May 31, 2018

REVISED BY

PUBLISHED
SRPS EN 60068-2-58:2016

Related project

Adopted from EN 60068-2-58:2004