Withdrawn
Outlines test Td, applicable to surface mounting devices, which are intended to mount on substrates. This standard provides the standard procedures for solder alloys containing lead and for lead-free solder alloys. Provides standard procedures for determining the solderability and resistance of soldering heat to lead-free solder alloys and for determining the solderability, dissolution of metallization (see B.3.3) and resistance of soldering heat to solder alloys which are eutectic or near eutectic tin lead solders. Include the solder bath method and reflow method.
WITHDRAWN
SRPS N.A5.782:1994
WITHDRAWN
SRPS EN 60068-2-58:2010
95.99
Withdrawal of Standard
May 31, 2018
PUBLISHED
SRPS EN 60068-2-58:2016