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SRPS N.A5.782:1994

Environmental testing - Part 2: Tests - Test Td: Solderability, resistance to dissolution of metallization and to soldering heat of Surface Mounting Devices (SMD)

May 4, 1994
May 4, 1994
95.99   Withdrawal of Standard   Jul 25, 2012

General information

95.99     Jul 25, 2012

ISS

N104

HD

Serbian  

Buying

Withdrawn

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Scope

Introduction: Test Td is applicable to Surface Mounting Devices (SMD) - Soldering tests applicable to other electrotechnical products are in HD 323-2-20 for which guidance is given in HD 323-2-44 and HD 323-2-54 The guidance for Test Td is given in appendix B - Terms and definitions from HD 323-2-20 have been used in this standard in the interests of consistancy but they will need to be reviewed later when Test T is revised - Specification writers will find in clause 7 a list of details to be considered for inclusion in specifications - Quantitatie procedures for evaluating the quality of soldering for SMD are under consideration - Object: To provide a standard procedure for determining the solderability resistance to dissolution of metallization and resistance to soldering heat of Surface Mounting Devices (SMD) (hereafter referred to as 'specimens') - The procedure uses a solder bath and is applicable only to specimens of products designed to withstand short-term immersion in molten solder

Life cycle

NOW

WITHDRAWN
SRPS N.A5.782:1994
95.99 Withdrawal of Standard
Jul 25, 2012

REVISED BY

WITHDRAWN
SRPS EN 60068-2-58:2010

WITHDRAWN
SRPS EN 60068-2-21:2010

Related project

Adopted from HD 323.2.58 S1:1991