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SRPS EN 62047-16:2016

Semiconductor devices - Micro-electromechanical devices - Part 16: Test methods for determining residual stresses of MEMS films – Wafer curvature and cantilever beam deflection methods

Jul 28, 2016

General information

60.60     Jul 28, 2016

ISS

N022

European Norm

31.080.99  

English  

sednica 2016-05-27

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Scope

IEC 62047-16:2015 specifies the test methods to measure the residual stresses of films with thickness in the range of 0,01 μ to 10 μ in MEMS structures fabricated by wafer curvature or cantilever beam deflection methods.

Life cycle

NOW

PUBLISHED
SRPS EN 62047-16:2016
60.60 Standard published
Jul 28, 2016

Related project

Adopted from EN 62047-16:2015