40.98 May 15, 2018
30.99 Nov 10, 2017
ISS
European Norm
IEC 63011-1:2018 provides definitions pertaining to multichip integrated circuits, as vertically stacked dies using through-silicon vias (TSVs) or micro bumps. Terms and definitions related to the fabrication and test of the multichip integrated circuits are also provided.
ABANDON
delSRPS EN 63011-1:2017
40.98
Project deleted
May 15, 2018