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delSRPS EN 63011-2:2017

Integrated circuits - Three dimensional integrated circuits - Part 2: Alignment of stacked dies having fine pitch interconnect

General information

40.98     May 15, 2018

45.99    Nov 9, 2018

ISS

N022

European Norm

Odustaje se zbog toga što je CLC odustao.

Scope

IEC 63011-2:2018 provides specifications of initial alignment and alignment maintenance between multiple stacked integrated circuits during the die bonding process. These specifications define the alignment keys and operating procedures of the keys. These specifications apply only if electrical coupling method of die-to-die alignment is used in the die stacking.

Life cycle

NOW

ABANDON
delSRPS EN 63011-2:2017
40.98 Project deleted
May 15, 2018

Related project

Adopted from prEN 63011-2:2017