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SRPS EN IEC 61189-2-807:2021

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-807: Test methods for materials for interconnection structures - Decomposition temperature (T<sub>d</sub>) using TGA

Dec 31, 2021

General information

60.60     Dec 31, 2021

ISS

N040

European Norm

31.180     31.18  

English  

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Scope

IEC 61189-2-807:2021 specifies a test method to determine the decomposition temperature (<em>T</em><sub>d</sub>) of base laminate materials using thermogravimetric analysis (TGA).

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NOW

PUBLISHED
SRPS EN IEC 61189-2-807:2021
60.60 Standard published
Dec 31, 2021

Related project

Adopted from EN IEC 61189-2-807:2021

Adopted from IEC 61189-2-807:2021 ED1 IDENTICAL