Projects

Semiconductor devices - Performance evaluation of semiconductor components and inspection equipment- Part 5: Evaluation methods for composition uniformity in laser dicing process

10.20   New project ballot initiated

Integrated Circuits - Standard roadmap for chiplet ICs

00.00   Proposal for new project received

integrated circuits – Three Dimensional Integrated Circuits Part x: In-line thermal measurement of warpage

00.00   Proposal for new project received

Integrated circuits – Part X: Standardization Roadmap for Fan-Out Packages

00.00   Proposal for new project received

IEC60191-6-23 Ed.1.0 :Standardization roadmap for fan-out packages

00.99   Approval to ballot proposal for new project

IEC 6xxxxx-2: Required Specifications of package substrates for advanced semiconductor packaging - Part 2 Failure Analysis Methods for Current Induced Quality Test of Package Substrates

00.00   Proposal for new project received

IEC 6xxxxx-3: Required Specifications of package substrates for advanced semiconductor packaging - Part 3 Standard Substrates structure for Current Induced Quality Test of Package Substrates

00.00   Proposal for new project received

Test method of sound variation detection sensors for fire detection

00.99   Approval to ballot proposal for new project

Semiconductor devices - Part 20: Machine-Interpretable Data Sheet for Power Semiconductors: Requirements for Data Format and Data Access for Power Electronic Design Tools

10.60   Close of voting

Semiconductor devices - Part 14-15: Semiconductor sensors - Performance test method of dynamic vision sensors

10.60   Close of voting

Semiconductor sensors - Measurement method for microchannel integrated resonant mass sensors in surface adsorption mode

10.20   New project ballot initiated

Semiconductor devices - Micro-electromechanical devices - Part 66: Test method for processing electrophysiological impedance data obtained from 3D cell-tissue models in MEMS chip array-based high-throughput screening systems

10.20   New project ballot initiated

Semiconductor devices - Micro-electromechanical devices - Part 67: Microfluidic device for droplet-based 3D cell cultivation

10.20   New project ballot initiated

CONNECTORS FOR ELECTRONIC EQUIPMENT PRODUCT REQUIREMENTS Part 8-10X: Power connectors – Detail specification for 2-pole snap locking power rectangular connectors with plastic housing for rated current of 63 A

00.99   Approval to ballot proposal for new project

Mechanical structures for electrical and electronic equipment – Walk-in enclosures – Part 1: Design guidelines

10.20   New project ballot initiated

Inductors - Near Magnetic and Electric Field Characterization

00.00   Proposal for new project received

<em>Standardized Data Format for Mission Profiles</em>

00.00   Proposal for new project received

Role-based Access Control – Definition of roles and permissions for engineering

00.99   Approval to ballot proposal for new project