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IEC 63378-6:2026 ED1

Thermal standardization on semiconductor packages - Part 6: Thermal resistance and capacitance model for transient temperature prediction at junction and measurement points
4. 2. 2026.

Опште информације

60.60     4. 2. 2026.

IEC

TC 47/SC 47D

Međunarodni standard

31.080.01  

francuski   engleski  

Kupovina

Objavljen

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Apstrakt

IEC 63378-6:2026 specifies a thermal resistance and capacitance model for semiconductor packages. This model is named the digital transformation using thermal resistance and capacitance (DXRC) model. It predicts transient temperature at junction and measurement points.
This document applies to semiconductor packages such as TO-252, TO-263, and HSOP. It supports single chip packages dissipated heat from single package surface.

Životni ciklus

TRENUTNO

OBJAVLJEN
IEC 63378-6:2026 ED1
60.60 Standard objavljen
4. 2. 2026.

Nacionalna preuzimanja

naSRPS EN IEC 63378-6:2023  
ISS

Termička standardizacija na kućištima poluprovodnika — Deo 6: Modul termičke otpornosti i kapacitanse za predviđanje temperaturnih tranzijenata na spoju i mernim tačkama

40.60   Završetak javne rasprave

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