IEC 61189-3-720 ED1

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-720: Test methods for interconnection structures (circuit boards) - Transmission loss test method for high frequency multilayer circuit boards

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Trenutna faza: 50.20 Effective date: 3. 7. 2026.

Sledeća faza: PRVD Datum sledeće faze: 14. 8. 2026.

Inicijator: IEC

Pripada: TC 91

Vrsta: Međunarodni standard

ICS: 31.180

Apstrakt

IEC 61189-3-720 ED1 specifies the S parameter test method for the internal transmission circuit of a multilayer circuit board (CB) for high frequency up to 50 GHz. The transmission loss test method that applies the via in pad plated over (VIPPO) structure to the CB surface contributes to improving the signal loss measurement precision and signal integrity of the internal transmission circuit of the high frequency CB. In addition, the use of back-drilling with VIPPO structure can eliminate influence of stubs on signal transmission.

Životni ciklus

TRENUTNO

PROJEKAT
IEC 61189-3-720 ED1
50.20 Početak postupka odobravanja definitivnog teksta nacrta standarda
3. 7. 2026.

Nacionalna preuzimanja

dnaSRPS EN IEC 61189-3-720:2025

ISS

Metode ispitivanja za električne materijale, štampane ploče i ostale strukture međusobnog povezivanja i sklopove – Deo 3-720: Metode ispitivanja za strukture međusobnog povezivanja (štampane ploče -

50.20 Početak postupka odobravanja definitivnog teksta nacrta standarda

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