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dnaSRPS EN IEC 61189-3-302:2023

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-302: Detection of plating defects in unpopulated circuit boards by computed tomography (CT)

General information

50.60     Sep 26, 2025

ISS

N040

European Norm

31.180  

English  

Scope

IEC 61189-3-302:2025 describes a method for the detection of plating defects in unpopulated circuit boards using computed tomography (CT).

This document is applicable to non-destructive testing of metallized holes.

Life cycle

NOW

PROJECT
dnaSRPS EN IEC 61189-3-302:2023
50.60 Close of voting. Proof returned by secretariat
Sep 26, 2025

Related project

Adopted from EN IEC 61189-3-302:2025 IDENTICAL

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