dnaSRPS EN IEC 61189-3-302:2023

Metode ispitivanja za električne materijale, štampane ploče i ostale strukture međusobnog povezivanja i sklopove – Deo 3-302: Otkrivanje nesavršenosti prevlaka štampanih ploča koje nisu popunjene pomoću kompjuterske tomografije (CT)

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-302: Detection of plating defects in unpopulated circuit boards by computed tomography (CT)

Apstrakt

IEC 61189-3-302:2025 describes a method for the detection of plating defects in unpopulated circuit boards using computed tomography (CT).

This document is applicable to non-destructive testing of metallized holes.