Objavljen
IEC 62899-202-9:2023 describes basic patterns to evaluate the electrical reliability of a conductive layer under mechanical deformation. Using the standard pattern described in this document, the comparison of the electrical reliability of a conductive layer under mechanical deformation is possible when the sample dimension is identical.
OBJAVLJEN
IEC 62899-202-9:2023 ED1
60.60
Standard objavljen
3. 8. 2023.