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Glavni meni

IEC TR 60286-7:2019 ED1

Packaging of components for automatic handling - Part 7: Introduction of a bulk blister pack for miniaturized components
14. 10. 2019.

Опште информације

60.60     14. 10. 2019.

IEC

TC 40

Tehnički izveštaj

31.020     31.240  

engleski   francuski  

Kupovina

Objavljen

Jezik na kome želite da primite dokument.

Apstrakt

IEC TR 60286-7:2019 contains information about the introduction of an innovative bulk blister packing system for miniaturized components, for example chip type components of size 1005 (metric) and smaller. It includes a proposal for standardization of the interface between the packaging and automatic assembly systems and requirements to the properties of the packaging.

Životni ciklus

TRENUTNO

OBJAVLJEN
IEC TR 60286-7:2019 ED1
60.60 Standard objavljen
14. 10. 2019.